Type 2 nanometer process (N2) is being regarded as the key technology for the next generation of CPUs. whistleblower QQ_Timmy quoted Morgan Stanley's report that demand for mobile devices and high-performance computing (HPC) continues to rise, a...
Type 2 nanometer process (N2) is being regarded as the key technology for the next generation of CPUs. whistleblower QQ_Timmy quoted Morgan Stanley's report that demand for mobile devices and high-performance computing (HPC) continues to rise, and two major processor manufacturers Intel and AMD's new products will be introduced into the Telco N2 stage, respectively, for Intel's Nova Lake and AMD EPYC Venice architecture.
AMD and Intel could join the N2 customer list in 1H26, we believe. As AMD announced Officially, its next-generation AMD EPYC processor, code-named “Venice,” has already been tapered out and will be brought up on TSMC advanced 2nm process technology. According to our industry… pic.twitter.com/2LwmXidztU
— 阿HaYaO (@QQ_Timmy) October 1, 2025
AMD executive director Su Zifeng officially announced in April this year that the next generation EPYC data center processor of the agent Venice has completed tape-out in the 2nm electric power process and will be the first to enter the verification and production process.
Intel part, Morgan Stanley reported that Nova Lake's Compute Tile is likely to be handed over to NTD for N2 production, mainly because the yield rate at its own 18A point is relatively low and the large-scale commercial level has not yet reached, forcing the company to turn key product lines to external manufacturing. The market is also worried about this, and the uncertainty of whether the 14A period can overcome the yield bottleneck is still high.
Report estimates that Taiwan Electric N production capacity will continue to expand in February: about 10,000 films in 2024, up to 50,000 films this year, reaching 95,000 films by the end of 2026, and is expected to rise to 140,000 films by the end of 2026, in response to the continuous increase in demand in HPC and mobile applications.
After AMD and Intel's 2 nanometers are used in TSMC, the dominant position of TEM CPU and HPC market is expected to be strengthened again. The outside world also pays attention to NTEC's accelerated advanced process layout, including the US factory A16 (1.6 nanometers) stage, which was launched one year in advance to meet market demand and political pressure on the ground.
TSMC’s 2nm Process Expected to Be a Game-Changer for Both AMD & Intel as They Position Next-Gen CPU Lineups Around It
