3DIC Advanced Packaging Manufacturing Alliance was established today, with more than 34 companies including Taiwan Electric Power. Cao Shiling, SEMI Global Marketing Director and Taiwan Region President, pointed out that the four major purposes of t...
3DIC Advanced Packaging Manufacturing Alliance was established today, with more than 34 companies including Taiwan Electric Power. Cao Shiling, SEMI Global Marketing Director and Taiwan Region President, pointed out that the four major purposes of the 3DIC Alliance are: linkage cooperation, strengthening supply chains, assisting in the introduction of existing standards, accelerating technological upgrades and business transformation.
He said that when the demand for AI chip performance exceeds the physical limit of a single chip, advanced packaging technologies such as 3D ICs will become the key path for real system integration. 3D ICs are also one of the important directions for the future development of Taiwan's semiconductor industry. Taiwanese semiconductor industry operators continue to invest in Taiwan, leaving their leading-edge technology and R&D foundations in Taiwan. When global supply chain reorganization, they also plan global participation opportunities.
Main members of the 3DIC Alliance: Allring Wan, Applied Materials Taiwan Applied Materials, APT Printing Energy, Besi Besie Semiconductor, Chroma Zhimao Electronics, CLC Tinding Technology, CMAC Jiamei Advanced Chemical Co., Ltd., Cmit Zhengmei Application, C SUN, Delta Delta, Disco, Eunodata Yuno Information, GMM Junhua Precision, GPM Junhao Precision, GPTC Hongsu Technology, HTA Junsheng Technology, Lam Rom, Nordson Noda Co., Ltd., PVA TePla, Scienttech Xin Yun, SUSS Hughes Micro Technology, TEL Tokyo Vili Technology, Viewtronic Technologies Visual Automation Technology, Yang Fayang Industrial, YAYATECH, ZEISS, Beli Technology, Advanced Technology, Taiwan Electric, Sun and Moonlight ASE, Yongguang Chemical, Xinxing Electronics, Yutian Xinji, Xishijun Technology Second Expert.
These semiconductor suppliers have equipment manufacturers, material manufacturers and packaging related manufacturers to form the 3DIC AMA (3DIC Advanced Manufacturing Alliance) alliance, and the majority of equipment manufacturers are.
The most important thing is that next, important AI-related technologies such as silicon photonics, 3D ICs, panel-level packaging and power management ICs, etc., Taiwanese companies should cooperate with the government to ensure that Taiwan maintains its leading position in order to cope with the opportunities brought by local production.
